Product description
Increase the operational efficiency and improve the yield of your electronics manufacturing lines with ESD Resin, a cost-effective solution to create custom ESD-safe production tooling.
Use ESD Resin to prototype and validate electronics production workflows, print static-dissipative parts that repel dust and powder, and create enclosures to protect sensitive electronics from static discharge
Support print resolutions: 100 µm and 50µm
Post-curing required
Overview
What's included
ESD Resin 1L
Compatibility
Printer compatibility: Form 3(+), Form 3L, Form 3B(+), Form 3BL, Form 3, Form 3B
Compatible with these resin tanks: Form 3 v2.1, Form 3L
Compatible with these build platforms: Form 3 Build Platform, Form 3 Build Platform 2, Form 3 Stainless Steel Build Platform, Form 3L Build Platform
Note: Print settings for this material may not be available yet on Form 3L and Form 3BL printers. Please visit our support page for more information.
Additional resin compatibility information is available on our Support site
Why ESD Resin
Use ESD Resin to reduce risk and increase the yield on your manufacturing line by 3D printing custom tools, jigs, and fixtures for automotive, aerospace, electronics manufacturing.
|
Static-Dissipative
Protect your critical electronics from unregulated static discharge to prevent component failures. |
High Toughness
With its high modulus and impact strength, ESD Resin is made to withstand operation on the production line. |
Applications
ESD Resin is a cost-effective solution for producing static-dissipative parts designed to endure use on the factory floor.
- Tooling & fixturing for electronics manufacturing
- Custom trays for component handling and storage
- Anti-static prototype and end-use components
Materials Properties
| Property
|
Post-cured at 70ºC |
| Surface Resistivity |
105 - 108 |
| Ultimate Tensile Strength |
44.2 MPa |
| Tensile Modulus |
1.937 GPa |
| Strain @ break |
12% |
| Notched Izod |
26 J/m |
| Heat Deflection Temperature 0.45 MPA |
54.2ºC |
| Heat Deflection Temperature 1.8 MPA |
62.2ºC |
Post-Processing
Form Wash Settings
Duration
20 Minutes in IPA / TPM
Notes
Do not leave ESD Resin in solvent for longer than 20 minutes, as excessive solvent exposure affects the quality of the final part. We recommend washing ESD Resin separately from other resins to avoid staining. |
Form Cure Settings
Duration Temperature
70° C 60 minutes
Notes
Follow the post-curing indications to achieve maximum material properties. |
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